Method of forming contact pads for wafer level testing and burn-

Details Method of forming contact pads for wafer level testing and burn- Method of forming contact pads for wafer level testing and burn-

1996-03-04

1997-01-14

Chaudhari, Chandra

Fishing, trapping, and vermin destroying

437190, 437226, H01L 2166

Patent

active

055939031

ABSTRACT:
A method of forming contact pads (140) that allows for wafer level testing and burn-in of semiconductor die (22). A plurality of semiconductor die (22) are formed upon a semiconductor wafer (20), each semiconductor die (22) having a plurality of bonding pads (78). A contact pad (140) is formed overlying each bonding pad (78) and is electrically coupled to the bonding pad (78) and to wafer test pads (38) through vertical and/or horizontal wafer conductors (42-47 and 52-53 respectively) so that each semiconductor die (22) is uniquely identified. Contact pads (140) protect underlying bonding pads (78) during the formation and removal of vertical and/or horizontal wafer conductors (42-47 and 52-53 respectively). Thus, wafer level electrical testing and/or burn-in can be performed prior to designating a final packaging method for the semiconductor die (22).

REFERENCES:
patent: 5237269 (1993-08-01), Aimi et al.
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5487999 (1996-01-01), Farnworth
patent: 5495667 (1996-03-01), Farnworth et al.

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