Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Patent
1996-03-29
1998-03-10
Niebling, John
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
438613, 438614, 438686, 204123, H01L 2128
Patent
active
057260753
ABSTRACT:
A method for forming an interconnect for a bare semiconductor is provided. The interconnect includes an insulating film with a pattern of conductors and microbumps adapted to make an electrical connection with contact locations on the die. The insulating film and conductors are mounted to a rigid substrate (e.g., silicon) using an lo elastomeric adhesive. The method includes forming conductive bus bars in electrical communication with the pattern of conductors to provide an electrical path for electroplating the microbumps onto the conductors. Following the electroplating step, the bus bars are severed and separate electrical paths are formed to the conductors. The bus bar can also be used in the completed interconnect to provide a common electrical path to select conductors. The interconnect can be used for testing the die or for providing a permanent electrical connection to the die.
REFERENCES:
patent: 5072289 (1991-12-01), Sugimoto et al.
patent: 5090118 (1992-02-01), Kwon et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5225037 (1993-07-01), Elder et al.
patent: 5262718 (1993-11-01), Svendsen et al.
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5367253 (1994-11-01), Wood et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5438223 (1995-08-01), Higashi et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5487999 (1996-01-01), Farnworth
Yamamoto, Yasuhikio et al., "Evaluation of New Micro-Connection System Using Microbumps", Nitto Denko Corp., Technical Paper, ISHM '93 Proceedings, pp. 370-378, 1995.
Miyake, Koyoshi et al., "Connectivity Analysis of New `Known Good Die` Connection System Using Microbumps", Technical Report, Nitto Denko Corp., pp. 1-7, 1994.
"Science Over Art. Our New IC Membrane Test Probe." Packard Hughes Interconnect Advertising Brochure, 1993.
Farnworth Warren M.
Gochnour Derek
Hembree David R.
Bilodeau Thomas G.
Gratton Stephen A.
Micro)n Technology, Inc.
Niebling John
LandOfFree
Method for fabricating microbump interconnect for bare semicondu does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for fabricating microbump interconnect for bare semicondu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating microbump interconnect for bare semicondu will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-138758