Method for forming a controlled impedance flex circuit

Details Method for forming a controlled impedance flex circuit Method for forming a controlled impedance flex circuit

1997-06-16

1998-06-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

22818021, H05K 310

Patent

active

057687765

ABSTRACT:
A system and method for providing a controlled impedance flex circuit includes providing an insulative flexible substrate having opposed first and second surfaces and having through holes extending from the first surface to the second surface. A pattern of conductive traces is formed on the first surface of the flexible substrate. A film of conductive adhesive is applied to the second surface and to the through holes. The through holes are aligned to contact ground traces in the pattern of conductive traces on the first surface. Thus, a ground plane is established for creating an environment for high frequency signal propagation. The conductive adhesive may be a b-stage epoxy or a thermoplastic material. In the preferred embodiment, a tape automated bonding frame is fabricated.

REFERENCES:
patent: 5070390 (1991-12-01), Shimizu
patent: 5087530 (1992-02-01), Wada et al.
patent: 5127570 (1992-07-01), Steitz et al.
patent: 5183711 (1993-02-01), Wada et al.
patent: 5367763 (1994-11-01), Lamm
patent: 5442231 (1995-08-01), Miyamoto et al.

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