Semiconductor memory device with selection gate in a groove

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257316, 257408, 257622, H01L 27115

Patent

active

053592182

ABSTRACT:
When the surfaces of a selection gate electrode and a floating gate electrode are thermally oxidized with the selection gate electrode disposed below the floating gate electrode, the thickness of a gate oxide film formed on the selection gate electrode can be made larger than that of a gate oxide film formed on the other portion. As a result, the coupling ratio of a memory transistor can be increased. Thus, the coupling ratio can be adequately increased by partly increasing the thickness of the insulation film between the floating gate electrode and the semiconductor substrate.

REFERENCES:
patent: 4649520 (1987-03-01), Eitan
patent: 4949140 (1990-08-01), Tam
patent: 4989053 (1991-01-01), Shelton
patent: 4989054 (1991-01-01), Arima et al.
patent: 5017979 (1991-05-01), Fujii et al.
Lander et al., "Recessed Gate One-Device Cell Memory Array", IBM Technical Disclosure Bulletin, vol. 18, No. 12, May 1976, New York, US, pp. 3951-3952.
Arima et al., "A High Density High Performance Cell for 4M Bit Full Feature Electrically Erasable/Programmable Read-Only Memory", Japanese Journal of Applied Physics, vol. 30, No. 3A, Mar. 1, 1991, Tokyo, JP, pp. 334-337.

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