Semiconductor device of the LOC structure type having a flexible

Details Semiconductor device of the LOC structure type having a flexible Semiconductor device of the LOC structure type having a flexible

1994-07-13

1995-12-05

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257723, 257696, H01L 23495, H01L 23498

Patent

active

054731887

ABSTRACT:
In a semiconductor device of the LOC (lead on chip) structure type according to the present invention, one ends of external connector leads are fixed to an insulating tape and the other ends thereof extend outside the insulating tape. Inner leads for internal wiring are arranged and fixed on the insulating tape, independently of the others. The insulating tape integral to both of these leads is fixed to the main surface of a semiconductor chip and the leads are connected to their corresponding electrode pads on the semiconductor chip via bonding wires. The insulating tape is bonded to a lead frame before the punching process and it thus made integral to the leads is then punched by the punching process. It therefore needs no bonding margin for the leads.

REFERENCES:
patent: 5089876 (1992-02-01), Ishioka
patent: 5252854 (1993-10-01), Arita et al.
patent: 5311057 (1994-05-01), McShane
patent: 5343366 (1994-08-01), Cipolla et al.

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