Method of forming a support structure for air bridge wiring of a

Details Method of forming a support structure for air bridge wiring of a Method of forming a support structure for air bridge wiring of a

1997-10-20

1999-04-06

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438622, 438624, 257522, H01L 21764

Patent

active

058917977

ABSTRACT:
A process of manufacturing integrated circuits is disclosed for designing and implementing a hierarchical wiring system. The interconnection requirements are sorted and designed into a particular wiring level according to length. Support structures may be constructed to allow more flexibility in designing air bridge dimensions. The support structures may take the form of lateral ribs or intermediate posts, and may be fabricated of either insulating or conductive material. One integrated circuit described is a memory device, such as a dynamic random access memory.

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Wolf, S., "Chapter 4: Multilevel-Interconnect Technology for VLSI and ULSI", In: Silicon Processing for the VLSI Era, vol. 2 Process Integration, Lattice Press, Sunset Beach, CA, 176-297, (1990).

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