Substrate heating mechanism

Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427573, 118719, 118724, 118725, 118728, 20429807, 20429809, 20419212, C23C 1400

Patent

active

054786096

ABSTRACT:
A substrate-heating mechanism has a heat source for heating a substrate for heating a substrate face side reverse to a film formation face in a film deposition on the film formation surface of the substrate held on a substrate holder in a vacuum chamber, the mechanism comprises a second vacuum chamber for maintaining vacuum the substrate face reverse to the film formation face.

REFERENCES:
patent: 4951603 (1990-08-01), Yoshino
patent: 5033407 (1991-07-01), Mizuno
patent: 5113929 (1992-05-01), Nakagawa
patent: 5180432 (1993-01-01), Hansen
patent: 5188058 (1993-02-01), Nakai
patent: 5252131 (1993-10-01), Kiyama
patent: 5284521 (1994-02-01), Atetagawa
patent: 5332442 (1994-07-01), Kubodera

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Substrate heating mechanism does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate heating mechanism, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate heating mechanism will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1367680

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.