Fishing – trapping – and vermin destroying
Patent
1992-01-03
1993-03-23
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437228, 156636, 511314, H01L 2166
Patent
active
051963531
ABSTRACT:
A method and apparatus for controlling a chemical mechanical planarization (CMP) process in semiconductor manufacture includes an infrared camera for detecting and mapping a temperature of the wafer for developing a thermal image of the wafer. The thermal image can then be analyzed and used to control the operational parameters of the (CMP) process such as time, temperature, and downward pressure, in order to enhance the uniformity of polishing across the wafer. In addition, it can be used to end-point the (CMP) process by detecting sudden changes in the wafer surface temperature as one layer is completely polished away exposing an underlying layer of a different material.
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Doan Trung T.
Sandhu Gurtej S.
Gratton Stephen A.
Hearn Brian E.
Holtzman Laura M.
Micro)n Technology, Inc.
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