Epoxy acrylate resins and photosensitive resin compositions ther

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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522100, 522103, 560221, 560209, 526284, 525922, 525531, G03F 7027, C08F28300, C08F 3600

Patent

active

051962969

ABSTRACT:
Epoxy acrylate resins of this invention having a structure of the general formula (I) ##STR1## in which R is hydrogen or a lower alkyl group, R' is hydrogen or methyl group, and n is an integer from 0 to 20 are heat-resistant, solvent-soluble, and photosensitive and photosensitive resin compositions containing said epoxy acrylate resins as main component exhibit high photosensitivity in addition to strong adhesion to substrates, good resistance to heat and chemicals, and good mechanical and electrical properties and are useful as materials for forming insulation films for multilayer devices and protective films for image sensors and as protective films for solder resists, plating resists, and color filters.

REFERENCES:
patent: 4122113 (1978-10-01), Turner
patent: 4252888 (1981-02-01), Rohloff
patent: 4264708 (1981-08-01), Chambers et al.
patent: 4663412 (1987-05-01), Guillet et al.

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