Method of making an electrical interconnection device

Details Method of making an electrical interconnection device Method of making an electrical interconnection device

1991-07-12

1993-03-23

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419236, 427404, 4272557, B29B 1300, B29B 1308

Patent

active

051961032

ABSTRACT:
The present invention refers to an electrical interconnection device having conductive metal layers separated by a dielectric cyclobutarene polymer layer. The adhesion of the conductive metal layer to the dielectric cyclobutarene polymer layer is promoted by a carbide-forming metal interface layer. Further disclosed is a method of making such electrical interconnection device by ion sputtering the dielectric cyclobutarene polymer surface, vapor depositing a carbide-forming metal interface layer onto the sputtered polymer surface, and then vapor depositing the superior conductive metal layer onto the carbide-forming metal interface layer.

REFERENCES:
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patent: 4902647 (1990-02-01), Chutjian et al.
Bodo et al., "Adhesion of Evaporated Titanium to Polyethylene: Effects of Ion Bombardment Pretreatment", J. of Vac. Sci. Technol., A2 (4), pp. 1498-1502 (1984).
Bodo et al., "Adhesion of Evaporated Titanium Films to Ion-Bombarded Polyethylene", J. Appl. Phys., 60 (3), pp. 1161-1168 (1986).
Bodoo et al., "The Adhesion of Evaporated Metal Films to Polyethylene Substrates", Surface and Interface Analysis, vol. 9, pp. 437-440 (1986).
Townsend et al., "Multilayer Interconnection Structures Using Second Generation Polymers Derived from Bisbenzocyclobutane", ISHM Proceedings, 1989.
Paik et al., "Interfacial Studies on Cr and Ti deposited on Benzocyclobutane (BCB) Film", Mat. Res. Soc. Meeting, Boston, Mass., Nov. 26-30, 1990.
Fong et al., "Polybenzocyclobutene Resins in Multilayer thin Films for Electronic Packaging", 22nd Int. SAMPE Tech. Conf. (1990).

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