Method for manufacturing a high density electronic circuit assem

Details Method for manufacturing a high density electronic circuit assem Method for manufacturing a high density electronic circuit assem

1997-06-02

1999-11-16

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438669, 438672, 216 20, H01L 2160

Patent

active

059857609

ABSTRACT:
Photoimageable dielectric materials are coated on substrates, selectively exposed and developed, whereby small vias and interconnection openings are formed between adjacently spaced circuit layers. A conductive paste may be used to provide sequential layer interconnection and surface planarization. No adhesives are required in the manufacture of a circuit assembly having multiple circuit and dielectric layers, and the manufacturing method avoids the requirement for drilled through holes and blind vias.

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