Method and apparatus for manufacturing pre-terminated chips

Details Method and apparatus for manufacturing pre-terminated chips Method and apparatus for manufacturing pre-terminated chips

1996-06-19

1999-03-09

Picardat, Kevin M.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

438113, H01L 21301

Patent

active

058800115

ABSTRACT:
A method and apparatus for forming edge terminations in multi-layer electrical component chips, such as capacitor chips, is arranged to cut holes through a laminated printed circuit pad at locations corresponding to the boundaries between adjacent chips when the pad is subsequently cut into individual chips. The holes are then filled with conductive ink to form plugs spanning the boundaries. The pad is then cut along a grid of perpendicular cutting lines defining the individual chip areas, simultaneously cutting through each of the ink plugs so that the cut ink plugs form the appropriate edge terminations along each side edge of a chip. The cutting device is suitably programmed to cut holes over the areas corresponding to the desired edge termination sizes and positions.

REFERENCES:
patent: 3374533 (1968-03-01), Burks et al.
patent: 3926746 (1975-12-01), Hargis
patent: 4426773 (1984-01-01), Hargis
patent: 4930216 (1990-06-01), Nelson
patent: 4949217 (1990-08-01), Ngo
patent: 5126286 (1992-06-01), Chance
patent: 5276963 (1994-01-01), Flanders

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