Opening filling apparatus for manufacturing a semiconductor devi

Details Opening filling apparatus for manufacturing a semiconductor devi Opening filling apparatus for manufacturing a semiconductor devi

1997-09-08

1999-11-16

Edwards, Laura

Coating apparatus

Gas or vapor deposition

With treating means

118725, 118641, 118 56, 118 58, 118500, 219405, 219411, 392416, 392418, C23C 1600

Patent

active

059850345

ABSTRACT:
There are disclosed an opening filling apparatus and a method for manufacturing a semiconductor device by using the same. An opening of a semiconductor device is filled by using the filling apparatus comprising: a chamber having a rotation shaft, a motor, a plurality of plates arranged in a circular form centering at the rotation shaft, and a heater; and injectors for injecting gas. When the opening of a semiconductor device such as a trench or a contact hole is filled, filling material may move down by using the centrifugal force generated by rotating the substrate, to thereby fill the opening completely without a void.

REFERENCES:
patent: 5329095 (1994-07-01), Okase
patent: 5683518 (1997-11-01), Moore et al.

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