Process for restructuring thin strip semi-conductor material

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156DIG88, C30B 102

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active

044103921

ABSTRACT:
A process for restructuring thin strip semiconductor material is disclosed. It comprises the steps of providing relative movement between the thin strip material and the heating station. The thin strip material is heated at the heating station to a desired temperature between the recrystallization temperature and the melting temperature. The strip is maintained at the desired temperature whereby preferred recrystallization and stress relief occurs within the material. In addition, the thin strip material may be elongated through elevating the temperature of the thin strip and/or increasing the longitudinal tension on the strip.

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