Method of forming conductive bumps on die for flip chip applicat

Details Method of forming conductive bumps on die for flip chip applicat Method of forming conductive bumps on die for flip chip applicat

1996-07-17

1998-04-07

Niebling, John

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438959, H01L 2144

Patent

active

057364567

ABSTRACT:
The present invention relates to an improved method for forming a UBM pads and solder bump connections for flip chip which eliminates at least one mask step required in standard UBM pad forming processes. The method also includes repatterning bond pad locations.

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