Method for producing electric circuits on a base boad

Details Method for producing electric circuits on a base boad Method for producing electric circuits on a base boad

1986-12-11

1988-02-09

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29620, 156634, 156656, 1566591, 156902, 338309, 427102, 427103, 427 96, B23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

047240407

ABSTRACT:
A method is described for producing multilayer circuits including a resistor circuit on one side of a copper laminated base board, wherein the base board is etched to provide a plurality of circuits of a first layer, effectively processed with a plating-resistant resist and an electrically conductive copper paste to form a plurality of circuits of a second layer, immersed in a metal plating solution to provide a metal plating layer on the copper paste to thereby form the circuits of the second layer on the circuits of the first layer, coated with an electrically conductive paste to provide a pair of electric terminals between two of the circuits of the second layer, and coated with an electrically resistant resist of a predetermined electric resistance value on a part extended between the two electric terminals.

REFERENCES:
patent: 3560256 (1971-02-01), Abrams
patent: 3761860 (1973-09-01), Ogasawara et al.
patent: 4496435 (1985-01-01), Harada et al.

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