Semiconductor chip kerf clear method for forming semiconductor c

Details Semiconductor chip kerf clear method for forming semiconductor c Semiconductor chip kerf clear method for forming semiconductor c

1997-05-01

1998-09-08

Tsai, Jey

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438462, H01L 2144, H01L 21301

Patent

active

058044647

ABSTRACT:
A fabrication method including a semiconductor chip kerf clear process and a resulting semiconductor chip and electronic module formed thereby. The fabrication method includes providing a wafer comprising a plurality of integrated circuit chips having kerf regions between them. Chip metallization is present within the kerf regions. A photolithography process is used to protect the wafer exposing only the kerf regions. Next, the wafer is etched, clearing the chip metallization from the kerf regions. The wafer is then diced and the chips are stacked to form a monolithic electronic module. A side surface of the electronic module is processed to expose transfer metals extending thereto, thereby facilitating electrical connection to the chips within the electronic module. Specific details of the fabrication method, resulting integrated circuit chips and monolithic electronic module are set forth.

REFERENCES:
patent: 3859127 (1975-01-01), Lehner
patent: 5103287 (1992-04-01), Mase et al.
patent: 5104820 (1992-04-01), Go et al.
patent: 5126231 (1992-06-01), Levy
patent: 5196378 (1993-03-01), Bean et al.
patent: 5249728 (1993-10-01), Lam
patent: 5259925 (1993-11-01), Herrick et al.
patent: 5266833 (1993-11-01), Capps
patent: 5324687 (1994-06-01), Wojnarowski
patent: 5391921 (1995-02-01), Kudoh et al.
patent: 5397916 (1995-03-01), Normingston
patent: 5532174 (1996-07-01), Corrigan
IBM Technical Disclosure Bulletin, vol. 32, No. 3B, Aug. 1989, New York, pp. 410-411, "Process for Producing Lateral Chip Connectors".

Affiliated with

Also associated with

Rating

Semiconductor chip kerf clear method for forming semiconductor c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip kerf clear method for forming semiconductor c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip kerf clear method for forming semiconductor c will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1281445