Encapsulation of integrated circuits

Details Encapsulation of integrated circuits Encapsulation of integrated circuits

1975-10-23

1977-04-12

Lowe, James B.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

29588, 264347, B29C 600

Patent

active

040174956

ABSTRACT:
Disclosed is a method of encapsulating integrated circuit chips formed on an insulating substrate which permits complete filling of areas under the chip. The encapsulant employed is a dispersion of a material, such as a silicone elastomer, which cures by reaction with water vapor. Subsequent to application of the encapsulant over and under the chip, the solvent of the dispersion is evaporated during a pre-cure treatment by means of a dry ambient of less than 5% relative humidity which suppresses crosslinking. After essentially all the solvent is thus removed, the encapsulant is cured by exposure to a second ambient of higher relative humidity which enhances crosslinking.

REFERENCES:
patent: 3606673 (1971-09-01), Overman
patent: 3631589 (1971-01-01), Gorceau
patent: 3661816 (1972-05-01), Pepe
patent: 3661817 (1972-05-01), Hamilton et al.
patent: 3819772 (1974-06-01), Kolobow
patent: 3845161 (1974-10-01), Beers

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