Method for manufacturing printed circuit boards

Details Method for manufacturing printed circuit boards Method for manufacturing printed circuit boards

1989-09-01

1990-07-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 29852, 156656, 1566591, 1566611, 156902, 2041291, 427 97, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

049433466

ABSTRACT:
A method for manufacturing printed circuit boards has a double etch process to form interconnection wiring. A metal layer is formed on the substrate. An etch resist layer is applied to the metal layer. The layer is selectively removed to allow for selective etching of the metal layer. A second etch resist layer is applied to the metal layer not previously etched. The side walls of the metal layer are also protected by the resist. The second etch resist layer is then selectively removed to allow for a second etching of the metal layer. After the second etching, the interconnection wiring remains in the desired pattern. The second etch resist layer, which may be tin, can be left on the wiring to improve component soldering.

REFERENCES:
patent: 3374129 (1968-03-01), Boucher
patent: 3764422 (1973-10-01), Koritke et al.
patent: 3850711 (1974-11-01), Conley

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