Thin film transistor fabrication method, active matrix substrate

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...

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438765, 438770, H01L 2131

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active

061502839

ABSTRACT:
To provide a TFT fabrication method capable of forming on a large-surface area substrate with uniform film thickness and at high deposition rate of film, while being a low-temperature process, a high-quality gate insulation film having good charge behavior by forming a silicon oxide film by a thin film transistor fabrication method having a channel region connected to a source region and a drain region, and a gate electrode confronting with the channel region through a gate insulation film, wherein in the formation process of said gate insulation film using plasma chemical vapor deposition under the condition that tetraethoxysilane is used as the feed gas to provide the silicon and the distance between electrodes for generating the plasma is about 15 mm or less.

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patent: 5426076 (1995-06-01), Moghadam
patent: 5858819 (1999-01-01), Miyasaka
patent: 5976989 (1999-11-01), Ishiguro
Sharp Technical Journal (No. 6, Apr. 1995) Low Temperature Deposition of High Quality Silicon Dioxide Films.

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