Fabrication process for flex circuit applications

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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216 47, G03F 700

Patent

active

061500712

ABSTRACT:
The invention provides a process for fabricating a flexible printed circuit with at least one etched or plated feature on each major surface of said flexible circuit, comprising the steps of providing an input material with two major surfaces, including a dielectric substrate and at least one conductive base layer, laminating a photoresist with a cover sheet onto at least one major surface of the input material, and printing an image onto the cover sheet or removing the coversheet and printing the image onto the photoresist directly.

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patent: 5637426 (1997-06-01), Uchikawa
patent: 5719749 (1998-02-01), Stopperan

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