Method for forming a polysilicon-interconnect contact in a TFT-S

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

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438166, 438586, 438652, 438674, 438656, 438677, H01L 2144, H01L 2100, H01L 2184, H01L 213205, H01L 214763

Patent

active

061108227

ABSTRACT:
A method of forming a contact in a thin film transistor with a gate electrode and an interconnect formed on a substrate, in an SRAM device comprises the following steps. Form a gate oxide layer over device. Form a split amorphous silicon layer over gate oxide layer. Form a cap layer over split amorphous silicon layer. Form a contact opening down to interconnect. Form contact metallization in opening on the surface of interconnect either as a blanket titanium layer followed by rapid thermal anneal to form a silicide and stripping unreacted titanium or by selective formation of a tungsten metal silicide in the opening. Strip cap layer from device. Form a second amorphous silicon layer on split silicon layer. Recrystallize silicon layers to form a polysilicon channel layer from amorphous silicon layers. Dope regions of polysilicon channel layer aside from a channel region above gate electrode.

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