Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1998-03-25
2000-08-29
Fahmy, Wael
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438166, 438586, 438652, 438674, 438656, 438677, H01L 2144, H01L 2100, H01L 2184, H01L 213205, H01L 214763
Patent
active
061108227
ABSTRACT:
A method of forming a contact in a thin film transistor with a gate electrode and an interconnect formed on a substrate, in an SRAM device comprises the following steps. Form a gate oxide layer over device. Form a split amorphous silicon layer over gate oxide layer. Form a cap layer over split amorphous silicon layer. Form a contact opening down to interconnect. Form contact metallization in opening on the surface of interconnect either as a blanket titanium layer followed by rapid thermal anneal to form a silicide and stripping unreacted titanium or by selective formation of a tungsten metal silicide in the opening. Strip cap layer from device. Form a second amorphous silicon layer on split silicon layer. Recrystallize silicon layers to form a polysilicon channel layer from amorphous silicon layers. Dope regions of polysilicon channel layer aside from a channel region above gate electrode.
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Fang Yean-Kuen
Huang Kuo-Ching
Liang Mong-Song
Yaung Dun-Nian
Ackerman Stephen B.
Berezny Neal
Fahmy Wael
Jones II Graham S.
Saile George O.
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