Wafer cooling method and apparatus

Details Wafer cooling method and apparatus Wafer cooling method and apparatus

1991-07-02

1994-06-14

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437247, 437248, 156345, 279128, 361233, 118724, H01L 21465

Patent

active

053209826

ABSTRACT:
This invention relates to a vacuum processing method and apparatus. When a sample is plasma-processed under a reduced pressure, a sample bed is cooled by a cooling medium kept at a predetermined temperature lower than an etching temperature, the sample is held on the sample bed, a heat transfer gas is supplied between the back of the sample and the sample installation surface of the sample bed, and the pressure of the heat transfer gas is controlled so as to bring the sample to a predetermined processing temperature. In this way, a sample temperature can be regulated rapidly without increasing the scale of the apparatus.

REFERENCES:
patent: 4261762 (1981-04-01), King
patent: 4384918 (1983-05-01), Abe
patent: 4457359 (1984-07-01), Holden
patent: 4615755 (1986-10-01), Tracy et al.
patent: 4771730 (1988-09-01), Tezuka
patent: 4842683 (1989-06-01), Cheng et al.
patent: 4864461 (1989-09-01), Kasahara
patent: 4931135 (1990-06-01), Horiuchi et al.
patent: 4949783 (1990-08-01), Lakios et al.
patent: 5106787 (1992-04-01), Yen
patent: 5203958 (1993-04-01), Arai et al.

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