Sputtering target

Details Sputtering target Sputtering target

1992-04-07

1993-03-02

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429812, 20429813, 20419217, C23C 1434, C23C 1435

Patent

active

051906309

ABSTRACT:
The present invention consists of a sputtering target wherein target pieces made of at least two different kinds of materials are compositely arrayed in a manner as to be divided into the respective materials, characterized by having at least one irregular erosion region which is defined as a region enclosed with a circle having an erosion width as its diameter, located at a region farthest from the center of gravity of the sputtering target within a region to be eroded in a curvilinear shape, the irregular erosion region being formed at least partly of target pieces made of at least two kinds of materials having either shapes or surface areas thereof different from those of the target pieces lying outside the irregular erosion region and are compositely arrayed in a manner as to be divided into the respective materials.

REFERENCES:
patent: 4505798 (1985-03-01), Ramachandran et al.

Affiliated with

Also associated with

Rating

Sputtering target does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sputtering target, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sputtering target will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-124668