Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-10-20
1992-04-28
Beck, Shrive
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156647, 156614, 4272552, 4272553, 427 531, 427 38, B05D 306, C23C 1600, C30B 2500, B44C 122
Patent
active
051085437
ABSTRACT:
Surface treatment is applied to a substrate by supplying thereto excited molecules in which the vibrational energy level is excited. SF.sub.6, O.sub.2, N.sub.2, etc., are used as the excited molecules and supplied to the substrate as beams. This method is particularly suitable for the surface treatment in the production of semiconductor devices.
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The Technology and Physics of Molecular Beam Epitaxy, Ed. Parker Plenum Press, N.Y. 1985.
Ninomiya Ken
Nishimatsu Shigeru
Okada Osami
Suzuki Keizo
Beck Shrive
Hitachi , Ltd.
Padgett Marianne L.
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