Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1996-11-08
1999-11-23
Guay, John
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257687, 257698, 257780, 257783, 257746, H01L 23485
Patent
active
059905638
ABSTRACT:
A ball grid array (BGA) semiconductor package includes a package case having a recess in an upper surface thereof, a semiconductor chip received in the recess, and a connection means provided on an active region of the chip. A molding compound molds the chip and fills a gap between the package case and the connection member. The package enables a thinner package fabrication and reduces an access time of a package device, thereby realizing a high speed device.
REFERENCES:
patent: 4811081 (1989-03-01), Lyden
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5319242 (1994-06-01), Carney et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5381599 (1995-01-01), Hall
patent: 5397921 (1995-03-01), Karnezos
patent: 5554887 (1996-09-01), Sawai et al.
patent: 5583370 (1996-12-01), Higgins, III et al.
patent: 5616958 (1997-04-01), Laine et al.
patent: 5637920 (1997-06-01), Loo
patent: 5656862 (1997-08-01), Papathomas et al.
patent: 5657206 (1997-08-01), Pedersen et al.
patent: 5726489 (1998-03-01), Matsuda et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5773882 (1998-06-01), Iwasaki
Guay John
LG Semicon Co. Ltd.
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