Method for fabricating resin-sealed semiconductor device using l

Details Method for fabricating resin-sealed semiconductor device using l Method for fabricating resin-sealed semiconductor device using l

1995-07-31

1999-11-23

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Laser ablative shaping or piercing

264139, 26427217, B29C 3702, B29C 7072, B29C 7076

Patent

active

059894741

ABSTRACT:
An insulating-resin dam bar made of ultraviolet-curing epoxy resin with a low adhesiveness to a leadframe is applied onto an outer lead by screen printing. After the leadframe is sealed with resin, the insulating-resin dam bar is removed by wet honing such as water-jet honing or laser irradiation. Thereafter, a resin-sealed semiconductor device is finished through normal fabrication processes.

REFERENCES:
patent: 4504427 (1985-03-01), Moyer
patent: 4592131 (1986-06-01), Deie
patent: 4919857 (1990-04-01), Hojyo
patent: 5232651 (1993-08-01), Okuno et al.
patent: 5258331 (1993-11-01), Masumoto et al.
patent: 5446080 (1995-08-01), Shima et al.

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