Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1981-08-31
1983-05-03
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156634, 156652, 156656, 1566611, 360122, 430312, 430316, 430318, C23F 102
Patent
active
043819664
ABSTRACT:
A method of fabricating from a single piece of copper foil the extremely fragile recording element structure of a multi-channel magnetic recording head having a linear array of bi-metal recording elements, in which the elements are comprised of elongated substantially parallel finger portions terminating in a common return, with each having a minutely thinned down recording zone. For high resolution recording head structures, the dimensions of the elements at the recording zone may typically be as thin as 0.1.times.10.sup.-3 inches with a width of 1.5.times.10.sup.-3 inches and length of 3.5.times.10.sup.-3 inches, where the total length of the recording elements may nevertheless be as long as three inches. The process comprises an etching technique and the application of one or more supports at appropriate times in the fabrication to protect the structure at its most vulnerable times. Full masking and deposition of bi-metal layer areas is accomplished prior to any etching steps to avoid, for example, having to re-register the recording element design on one side of the copper foil relative to the other.
REFERENCES:
patent: 3801388 (1974-04-01), Akiyama et al.
IBM Technical Disclosure Bulletin, vol. 16, No. 5, Oct. 1973, Two-Side Etching for Thick Films by A. W. Cummins et al., pp. 1604-1605.
Nelson Alfred M.
Rasekhi Houshang
Funk Joseph E.
Powell William A.
Shanahan Michael H.
Wang Laboratories, Inc.
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