Manufacture of electronic devices comprising thin-film circuitry

Details Manufacture of electronic devices comprising thin-film circuitry Manufacture of electronic devices comprising thin-film circuitry

1996-10-15

1998-07-07

Bowers, Jr., Charles L.

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

On insulating substrate or layer

438164, 438166, 438487, 438795, 438967, H01L 2184

Patent

active

057768030

ABSTRACT:
A method of manufacturing a large-area electronic device such as a flat panel display, which method includes subjecting a semiconductor film on a polymer substrate to an energy beam treatment, e.g., for crystal growth or to anneal an ion implant, and masking the substrate prior to treatment to prevent exposure to the energy beam, wherein the adhesion of the film and other layers on the substrate is improved by first heating the substrate to pre-shrink it, and then depositing the layers on the pre-shrunk substrate at a lower temperature than the heating temperature.

REFERENCES:
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patent: 5254208 (1993-10-01), Zhang
patent: 5275851 (1994-01-01), Fonash et al.
patent: 5346850 (1994-09-01), Kaschmitter et al.
patent: 5456763 (1995-10-01), Kaschmitter et al.
patent: 5514466 (1996-05-01), Yamada et al.
patent: 5523587 (1996-06-01), Kwo
English language abstract 05-326042, Patent Abstracts of Japan, vol. 18, No. 141, Japanese Patent Application Kokai JP-A-05-326402.
English language Abstract 04-33213, Patent Abstracts of Japan, vol. 17 No. 178, Japanese Patent Application Kokai JP-A-04-332134.

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