Method of making transducer

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156647, 156648, 156650, 1566591, H01L 21306

Patent

active

042933730

ABSTRACT:
A silicon transducer including a silicon frame with one or more lands extending from a diaphragm or the like. The lands are interconnected by two thin strips formed integrally with the lands. The strips are essentially the transducer. The transducer is constructed by etching a boron doped wafer with a mixture of catechol, ethylene diamine and water.

REFERENCES:
patent: 3888708 (1975-06-01), Wise et al.
patent: 3912563 (1975-10-01), Tomioka et al.
patent: 4108715 (1978-08-01), Ishikawa et al.
INSPEC: IEEE Transactions on Electron Devices, vol. Ed-23, No. 6, pp. 579-583, Jun. 1976, Schottky Diodes and Other Devices on Thin Silicon Membranes by C. L. Huang et al.

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