Method of manufacturing lead frame used in electronic component

Details Method of manufacturing lead frame used in electronic component Method of manufacturing lead frame used in electronic component

1992-10-05

1994-02-15

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 1566591, 156902, 29827, 257666, 437220, B44C 122, C23F 100

Patent

active

052863425

ABSTRACT:
The thickness of a portion of a metal plate for constituting a lead frame, which corresponds to a tip portion of respective lead terminals of the lead frame, is partially made thin by way of an etching treatment. Subsequently, the respective lead terminals of the lead frame are formed by a punching process or an etching process.

REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 3795044 (1974-03-01), Peltz
patent: 4704187 (1987-11-01), Fujita
patent: 4711700 (1987-12-01), Cusack
patent: 4994411 (1991-02-01), Naito et al.

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