Patent
1989-08-04
1992-01-21
James,, Andrew
357 70, 357 72, H01L 2328, H01L 2348, H01L 2944, H01L 2960
Patent
active
050831933
ABSTRACT:
To further reduce the manufacturing costs of semiconductor devices, such as TO-92 transistors or thyristors, a prefabricated plastic can or housing is filled with cast resin, and the chip, together with its leads and a synthetic-resin cover, is inserted into the cast resin and the can, with portions of the leads engaging a groove in the can. The apparatus for inserting the chips, etc., into the cans includes a feed rail for the cans, a centering slide, and a swivelling gripper onto which the cans are pushed by the centering slide. When rotated, the swivelling gripper slips the cans over the chips mounted on a lead frame moving above the swivelling gripper.
REFERENCES:
patent: 3231797 (1966-01-01), Koch
patent: 3235937 (1966-02-01), Lanzl et al.
patent: 3465210 (1969-09-01), Bertram et al.
patent: 4346396 (1982-08-01), Carroll, II et al.
Patent Abstracts of Japan, vol. 7, No. 233, Oct. 15, 1983 "Hybrid Integrated Circuit Device", Pat. No. 58-121652.
Patent Abstracts of Japan, vol. 9, No. 298, Nov. 26, 1985 "Semiconductor Device and Manufacture Thereof", Pat. No. 60-136347.
Patent Abstracts of Japan, vol. 9, No. 318, Dec. 13, 1985 "Case for Semiconductor Device", Pat. No. 60-150654.
Heitzler Viktor
Kapp Richard
Deutsche ITT Industries GmbH
James Andrew
Jr. Carl Whitehead
Peterson Thomas L.
LandOfFree
Semiconductor package, method of manufacturing the same, apparat does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package, method of manufacturing the same, apparat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package, method of manufacturing the same, apparat will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-119338