Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-07-18
1992-10-06
Kunemund, Robert
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
310313B, 310313R, 4271264, 427100, H01L 4108
Patent
active
051528649
ABSTRACT:
Interdigital transducers and reflectors are formed on a piezoelectric substrate from an aluminum film. The aluminum film is formed by electron beam deposition at a film forming rate which is controlled to be at least 20 .ANG. per second. The aluminum film formed in this way is crystallographically oriented in a constant direction, whereby stressmigration of the aluminum film is suppressed.
REFERENCES:
patent: 4511816 (1985-04-01), Mikoshita et al.
patent: 4602228 (1986-07-01), Yamada
patent: 4623426 (1986-11-01), Peters
patent: 4635009 (1987-01-01), Ebata
patent: 4775814 (1988-10-01), Yuhara et al.
patent: 4868444 (1989-09-01), Shibata et al.
patent: 4906885 (1990-03-01), Kojima et al.
Wolf et al., "Silicon Processing", Lattice Press, Sunset Beach, Calif., 1987, pp. 156-158.
MacDonald et al., "Development of a Two-Step E-Beam Lithography Process for Submicron SAW Device Fabrication", Optical Engineering, vol. 18, No. 1, pp. 53-58.
Ieki Hideharu
Kimura Koji
Sakurai Atsushi
Horton Ken
Kunemund Robert
Murata Manufacturing Co. Ltd.
LandOfFree
Method of manufacturing surface acoustic wave device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing surface acoustic wave device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing surface acoustic wave device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1186907