Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-04-23
1985-06-11
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156644, 156646, 156653, 156657, 1566591, 156668, 204192E, 252 791, B44C 122, C03C 1500, C03C 2506
Patent
active
045226814
ABSTRACT:
Holes in substrates are produced by a photolithography-plasma dry etching method employing a positive photoresist mask such as poly(methyl methacrylate) which is capable of being isotropically eroded by plasma action. The result is simultaneous anisotropic etching of the substrate and isotropic erosion of the mask, producing tapered holes.
REFERENCES:
patent: 3986912 (1976-10-01), Alcorn et al.
patent: 4092210 (1978-05-01), Hoepfner
patent: 4293375 (1981-10-01), Neukomm
Weiss, Semiconductor International, Feb. 1983, pp. 56-62, Plasma Etching of Oxides and Nitrides.
Weiss, Semiconductor International, Nov. 1983, pp. 114-118, Etching Systems.
Viswanathan, J. Vac. Sci. Technol., vol. 16, No. 2, pp. 388-390, (1979), Simulation of Plasma-etched Lithographic Structures.
Gorowitz Bernard
Saia Richard J.
Davis Jr. James C.
General Electric Company
Magee Jr. James
Pittman William H.
Powell William A.
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