Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Patent
1998-04-03
2000-04-11
Bowers, Charles
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
438787, 438781, 438782, 438624, H01L 21208
Patent
active
060488042
ABSTRACT:
A process for forming a nanoporous dielectric coating on a substrate. The process follows the steps of blending an alkoxysilane with a solvent composition and optional water; depositing the mixture onto a substrate while evaporating at least a portion of the solvent composition; placing the substrate in a sealed chamber and evacuating the chamber to a pressure below atmospheric pressure; exposing the substrate to water vapor at a pressure below atmospheric pressure and then exposing the substrate to base vapor.
REFERENCES:
patent: 5736425 (1998-04-01), Smith et al.
Ramos Teresa
Roderick Kevin H.
Smith Douglas M.
Wallace Stephen
Allied-Signal Inc.
Bowers Charles
Criss Roger H.
Rocchegiani Renzo
Weise Leslie A.
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