Method for crystallizing an amorphous silicon thin film

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

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438486, 438487, H01L 2100, H01L 2184

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active

060487585

ABSTRACT:
A little amount of nickel is introduced into an amorphous silicon film formed on a glass substrate to crystallize the amorphous silicon film by heating. In this situation, nickel elements remain in a crystallized silicon film. An amorphous silicon film is formed on the surface of the crystallized silicon film and then subjected to a heat treatment. With this heat treatment, the nickel elements are diffused in the amorphous silicon film, thereby being capable of lowering the concentration of nickel in the crystallized silicon film.

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patent: 5759879 (1998-06-01), Iwasaki
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patent: 5797999 (1998-08-01), Sannomiya et al.
patent: 5837569 (1998-11-01), Makita et al.
patent: 5859443 (1999-01-01), Yamazaki et al.

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