Testable tape for bonding leads to semiconductor die and process

Details Testable tape for bonding leads to semiconductor die and process Testable tape for bonding leads to semiconductor die and process

1984-02-09

1985-04-09

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566591, 156901, 204 15, 357 70, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

045100179

ABSTRACT:
A testable tape for forming electrical innerlead connections between conductive pads, such as in semiconductor die, and a process for manufacturing the testable tape are disclosed. The testable tape includes a plurality of leads arranged in a pattern to form the innerlead bonds to the die. The plurality of leads is supported with a dielectric fill formed selectively on the lead pattern to support and electrically isolate the leads for testing.

REFERENCES:
patent: 3539259 (1970-11-01), Hillman et al.
patent: 3773628 (1973-11-01), Misawa et al.
patent: 4089733 (1978-05-01), Zimmerman

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