Method and device for acquiring redundancy information from a pa

Details Method and device for acquiring redundancy information from a pa Method and device for acquiring redundancy information from a pa

Filed on

1993-12-22

Date issued

2000-08-08

Examiner

Wright, Norman M.

Patent Class

Error detection/correction and fault detection/recovery

SubClass

Data processing system error or fault handling

SubSubClass

Reliability and availability

Other Related Categories

714 25, H02H 305

Type

Patent

Status

active

Patent number

061016187

Description

ABSTRACT:
A method and circuit for testing a packaged semiconductor memory device allow the acquisition of information on redundant elements by performing one of three possible redundancy rollcall tests on the packaged memory chip. By stimulating the packaged device's pins, the memory chip is set in one of the three test modes. In the first test mode, a preset signal indicating redundancy is sensed and the state of an output pin is changed. In the second test mode, memory array rows are sequentially addressed and the state of an output pin is changed when a redundant row is addressed. In the third test, array columns are sequentially addressed and, when a redundant column is addressed, the state of the output pin to which the redundant column is mapped is changed.

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R.W. Haddad et al., "Increased Throughput for Testing and Repair of Rams w/ Redundancy," IEEE Trans. on Computers, vol. 40, No. 2, Feb. 1991, pp. 154-166.
P. Mazumder et al., "Parallel Testing Pattern-Sensitive Faults in Semiconductor Random-Access Memories," IEE Trans. on Computers, vol. 38, No. 3, Mar. 1989, pp. 394-407.

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