Array type semiconductor device having insulating circuit board

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Details

257676, 257784, 361767, 361783, 361813, H01L 2348, H01L 2944

Patent

active

053999045

ABSTRACT:
There is provided a semiconductor device comprising a lead frame including an island and a plurality of leads, a semiconductor chip, mounted on the island, having bonding pads, the semiconductor chip further including circuit blocks connected to bonding pads, and an insulating circuit substrate, mounted on the island, including a plurality of conductive layers each having connection pads. In the structure, the bonding pads are connected to the connection pads to provide electrical connections among the circuit blocks.

REFERENCES:
patent: 4903114 (1990-02-01), Aoki et al.
patent: 5053852 (1991-10-01), Biswas et al.
patent: 5168368 (1992-12-01), Gow, 3rd et al.
patent: 5220195 (1993-06-01), McShane et al.
patent: 5227662 (1993-07-01), Ohno et al.
patent: 5264730 (1993-11-01), Matsuzaki

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