Method for bonding a lead to a die pad using an electroless plat

Details Method for bonding a lead to a die pad using an electroless plat Method for bonding a lead to a die pad using an electroless plat

1991-10-09

1993-11-09

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437220, 437230, H01L 2158, H01L 2160

Patent

active

052602346

ABSTRACT:
An interconnect structure comprising an interconnection formed between a bond pad and the end of a lead. The layer includes nickel, copper, cobalt, palladium, platinum, silver or gold and is electrically conductive. Also, an apparatus for forming an interconnection by a metal plating process and a device having a lead, a substrate, and a bath containing an aqueous metal plating solution which permits formation of the interconnect structure. A method of forming an interconnect structure including the step of placing a lead adjacent to a bond pad and placing the two in an electroless plating solution so that the interconnect structure may be formed.

REFERENCES:
patent: 3597834 (1971-08-01), Lathrop et al.
patent: 3625837 (1971-12-01), Nelson et al.
patent: 3870068 (1975-03-01), Dutkewych et al.
patent: 3965277 (1976-06-01), Guditz et al.
patent: 4122215 (1978-10-01), Vratny
patent: 4143618 (1979-03-01), Del Vecchio
patent: 4205099 (1980-05-01), Jones et al.
patent: 4406248 (1983-09-01), Araki et al.
patent: 4824803 (1989-04-01), Us et al.
patent: 4933049 (1990-06-01), Murphy et al.
patent: 5019209 (1991-05-01), Hiraide et al.
Merrill L. Minges et al., "Electronic Materials Handbook--vol. 1, Packaging", ASM International, p. 11450, (Nov., 1989).
Donald P. Seraphim et al., "Principles of Electronic Packaging", McGraw-Hill Book Company, 476-484; 493-500; 581-582; 611-618 (1989).

Affiliated with

Also associated with

Rating

Method for bonding a lead to a die pad using an electroless plat does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for bonding a lead to a die pad using an electroless plat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for bonding a lead to a die pad using an electroless plat will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1142504