TiSi.sub.2 /TiN clad interconnect technology

Details TiSi.sub.2 /TiN clad interconnect technology TiSi.sub.2 /TiN clad interconnect technology

1995-06-07

1996-12-31

Fourson, George

Fishing, trapping, and vermin destroying

437192, 437200, 437193, H01L 2128

Patent

active

055894178

ABSTRACT:
A TiSi.sub.2 /TiN clad LI strap process and structure are disclosed which combine the advantages of both TiSi.sub.2 and TiN LI processes. According to the invention, the retention of a thin TiN layer between the local interconnect and contacts provides a diffusion barrier against counterdoping and relaxes the thermal budget for subsequent processing.

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