Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1994-02-17
1996-12-31
Lesmes, George F.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
4302861, 4302811, 4302871, 430906, 522137, 522138, 522142, G03C 173
Patent
active
055893198
DESCRIPTION:
BRIEF SUMMARY
DESCRIPTION
1. Technical Field
The present invention relates to a photosensitive resin composition. More specifically, it relates to a highly photosensitive and easily manufacturable resin composition suitable for the manufacture of thick films.
2. Background Art
As heat-resistant photosensitive materials, photosensitive polyimides are widely used to form insulating films and passivation films for semiconductors. Most of the photosensitive materials are polyimides or their precursors into which photosensitive groups are introduced, and mixtures of polyimide precursors and compounds having photosensitive groups. As examples of the former, Japanese Patent Publication No. (Sho)55-41422 discloses an ester of polyamic acid in which a photosensitive group is bonded to a side chain, and Japanese Patent Application Laid-open No. (Sho)60-6029 discloses a method for synthesizing a photosensitive polyimide by the use of a previously synthesized diamine having a double bond. However, in these methods, a process of introducing the photosensitive group is unpreferably complex.
Furthermore, Japanese Patent Application Laid-open Nos. (Sho)55-45746 and (Sho)60-100143 discloses a method in which an unsaturated epoxy compound or an unsaturated isocyanate compound is reacted with a carboxyl group of each polyamic acid, but this method has the drawback that on reacting an epoxy group or an isocyanate group with the carboxyl group of the polyamic acid, a part of the polyamic acid is decomposed, so that the viscosity of a solution decreases. As the mixtures of the polyimide precursor of the polyamic acid and the compounds having the photosensitive group of the latter, compositions prepared by mixing the polyamic acid and compounds having a photoreactive unsaturated group are disclosed in, for example, Japanese Patent Application Laid-open Nos. (Sho) 63-206740, (Sho)59-15449 and (Hei)2-144539. However, in Japanese Patent Laid-open No. (Sho)63-206740, a peroxide is used as an initiator, and hence shelf stability is poor. In Japanese Patent Application Laid-open Nos. (Sho)59-15449 and (Hei)2-144539, the polyamic acids having specific structures are used, and hence practical physical properties such as heat resistance and mechanical strength unpreferably decline.
On the other hand, Japanese Patent Laid-open No. (Sho)54-145794 discloses a method which comprises mixing a compound containing a double bond and an amino group or its quaternary salt with the polyamic acid. The composition obtained by this mixing method has good compatibility but low sensitivity, and it has the problem that cracks tend to occur at the time of development. In Japanese Patent Application Laid-open No. (Hei)3-91752, it is described to use a specific polyfunctional amino acrylate. In this technique, problems such as the sensitivity and the crack formation at the development can be solved, but this polyfunctional amino acrylate is less available as a commercial product.
DISCLOSURE OF THE INVENTION
SUMMARY OF THE INVENTION
An object of the present invention is to provide a highly photosensitive and easily manufacturable resin composition suitable for the manufacture of thick films having a practically sufficient sensitivity, and according to this resin composition, the above-mentioned drawbacks of conventional photosensitive materials can be overcome.
The present inventors have conducted various investigations, and as a result, they have found that a photosensitive resin composition suitable for thick films can be easily obtained by using an isocyanurate having a specific (meth)acrylic group and a polyalkylene glycol di(meth)acrylate in a specific ratio. In consequence, the present invention has been completed.
That is, a photosensitive resin composition of the present invention is characterized by comprising (1) 100 parts by weight of a polyimide, (2) 10-100 parts by weight of an isocyanurate having a (meth)acrylic group, (3) 10-100 parts by weight of a polyalkylene glycol di(meth)acrylate, and (4) 0.5-20 parts by weight of a photopolymerization initiato
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Katou Kouichi
Kunimune Kouichi
Watanabe Eiji
Chisso Corporation
Lesmes George F.
Weiner Laura
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