Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-09-24
1993-11-09
Hearn, Brian E.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156658, 156660, 427264, B44C 122
Patent
active
052599264
ABSTRACT:
Disclosed is an improvement in a thin-film pattern manufacturing method which includes the steps of providing a thin film on a substrate, forming a mask having a desired pattern on the thin film, and patterning the thin film by removing an exposed portion of the thin film by etching. According to the improvement, the mask is manufactured by forming a layer of an organic resin on the thin film on the substrate and by forming the organic resin layer in the desired pattern by a mechanical forming member. In another embodiment, the organic resin is directly formed or moulded on the thin film by a forming or moulding member.
REFERENCES:
patent: 4294650 (1981-10-01), Werthmann
patent: 4983499 (1991-01-01), Suzuki et al.
patent: 5008176 (1991-04-01), Kondo et al.
patent: 5091047 (1992-02-01), Cleeves et al.
patent: 5093158 (1992-03-01), Li et al.
patent: 5123998 (1992-06-01), Kishimura
Kuwabara Kazuhiro
Mikami Yoshiro
Mori Yuji
Hearn Brian E.
Hitachi , Ltd.
Picardat Kevin M.
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