Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1977-12-01
1980-11-25
Bernstein, Hiram H.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156DIG67, 156DIG79, C30B 1904
Patent
active
042356636
ABSTRACT:
A thin (less than 500.mu.m) epitaxial dielectric layer having low photoconductivity is grown on a monocrystalline wafer composed of Bi.sub.12 GeO.sub.20 by a liquid-phase epitaxial growth technique. The composition of the liquid melt from which the dielectric layer is grown is composed of a pseudo-three-component system defined by the formula:
REFERENCES:
patent: 4092208 (1978-05-01), Brice et al.
Translation of Japanese Unexamined Patent Application No. 50-130466+Application.
Journal of Applied Physics vol. 36, No. 2, 1965, Nitsche.
Translation (Supplied by Applicant) of Japanese Unexamined Patent Application No. 50-130466+Application.
Journal of Applied Physics vol. 36, No. 8, Aug. 1965, Nitsche.
Okamoto Tsutomu
Tamura Hidemasa
Bernstein Hiram H.
Sony Corporation
LandOfFree
Method of producing a dielectric of two-layer construction does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of producing a dielectric of two-layer construction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing a dielectric of two-layer construction will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1128177