Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1993-09-17
1994-09-13
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430288, 430914, 430920, 430921, 430926, 430917, 522 25, 522 31, G03C 172, G03F 7029
Patent
active
053468058
ABSTRACT:
A photopolymerizable composition comprises a polymerizable compound having at least one ethylenically unsaturated double bond and a photopolymerization initiator, wherein the photopolymerization initiator comprises an onium compound and an acridine derivative represented by the following general formula (I): ##STR1## wherein R.sup.1 represents an unsubstituted or substituted phenyl, alkyl or alkoxy group. The composition has high sensitivity to actinic rays over a wide range of wavelength extending from ultraviolet to visible region and thus can be used for preparing a lithographic printing plate, a resin-letterpress plate, a resist or photomask for making a printed board, a monochromatic and colored sheet for transfer or color-development and a color-developing sheet.
REFERENCES:
patent: 4019972 (1977-04-01), Faust
patent: 4610952 (1986-09-01), Crivello
patent: 4708925 (1987-11-01), Newman
patent: 4737445 (1988-04-01), Frommeld et al.
patent: 4940648 (1990-07-01), Geiger
patent: 5045433 (1991-09-01), Kakumaru et al.
Kondo Syun-ichi
Umehara Akira
Ashton Rosemary
Fuji Photo Film Co. , Ltd.
McCamish Marion E.
LandOfFree
Photopolymerizable composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photopolymerizable composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photopolymerizable composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1119681