Photoresist composition comprising a copolymer having a di-t-but

Details Photoresist composition comprising a copolymer having a di-t-but Photoresist composition comprising a copolymer having a di-t-but

1993-09-15

1994-09-13

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430165, 430189, 430192, 430326, 430330, 430910, 430921, 430925, 430945, G03F 7004

Patent

active

053468031

ABSTRACT:
A photoresist composition comprises a polymer of the following formula (1): ##STR1## wherein R.sup.1 is a substituted or unsubstituted aromatic group or --(CH.sub.2).sub.p --SiR.sup.3 wherein R.sup.3 is a methyl or ethyl group and p is equal to 0 or 1, R.sup.2 is a hydrogen atom or methyl group, t-Bu is a tertiary-butyl group, and n/(m+n) is in the range of from 0.1 to 0.9.
The polymer of formula (1) can form a positive working two-component photoresist composition with a photoacid generator. The polymer of formula (1) can also be used as an alkali soluble resin and in this regard, form a positive working three-component photoresist composition with a photoacid generator and a dissolution inhibitor having at least one group which is unstable to acid. Alternatively, the polymer of formula (1) can be used as a dissolution inhibitor and in this regard, form a positive working three-component photoresist composition with another alkali soluble resin and a photoacid generator.

REFERENCES:
patent: 4678737 (1987-07-01), Schneller et al.
patent: 5068168 (1991-11-01), Lee
patent: 5238781 (1993-08-01), Shadeli et al.
patent: 5252427 (1993-10-01), Bauer et al.

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