Radiant energy – Photocells; circuits and apparatus – Optical or pre-photocell system
Patent
1993-08-09
1995-01-31
Nelms, David C.
Radiant energy
Photocells; circuits and apparatus
Optical or pre-photocell system
250234, 250306, 156647, 437225, G01B 734
Patent
active
053861108
ABSTRACT:
A method of making a cantilever chip for a scanning probe microscope wherein the cantilever chip includes a cantilever portion, a probe portion formed at a free end of the cantilever portion, a mirror portion formed on the cantilever portion on a side opposite to a side where the probe portion is formed, and a support portion for supporting the proximal end of the cantilever portion. A step is formed between the cantilever portion and the support portion, so that the support portion is set back from the surface of the cantilever portion on the side where the probe portion is formed. Semiconductors manufacturing processes and etching processes are used.
REFERENCES:
patent: Re33387 (1990-10-01), Binning
patent: 5021364 (1991-06-01), Akamine et al.
patent: 5051379 (1991-07-01), Bayre et al.
patent: 5066358 (1991-11-01), Quate et al.
patent: 5129132 (1992-07-01), Zdeblick et al.
patent: 5149673 (1992-09-01), MacDonald et al.
patent: 5193385 (1993-03-01), Nishioka et al.
patent: 5248912 (1992-09-01), Zdeblick et al.
patent: 5264696 (1993-11-01), Toda
patent: 5266502 (1993-11-01), Okada et al.
patent: 5282924 (1994-02-01), Bayer et al.
Article entitled "Microfabrication Of Cantilever Styli For The Atomic Force Microscope" by T. R. Albrecht, et al, published in J. Vac. Sci Technol. A 8(4), Jul./Aug. 1990, pp. 3386-3396.
Article entitled "Silicon As A Mechnaical Material" by Petersen published in Proceedings of IEEE, vol. 70, No. 5, May, 1982, pp. 443-450.
Article entitled "High Resolution Pressure Sensor Fabricated By Silicon Wafer Direct Bonding" by C. S. Chung, published in Electronics Letters, vol. 27, No. 12, Jun. 6, 1991, pp. 1098-1100.
J. Appl. Phys. 62(7), Oct. 1, 1987, pp. 2599-2602, 1987 American Institute of Physics.
Appl. Phys. Lett. 57(3), Jul. 16, 1990, pp. 316-318, 1990 American Institute of Physics.
Artile entitled "Micromachining And Micropackaging Of Transducers" by C. D. Fung, et al, published in Studies in Electrical and Electronic Engineering 20, Elsevier, Amsterdam-oxford-New York-Tokyo 1985, title page and pp. 114-124.
Lee John R.
Nelms David C.
Olympus Optical Co,. Ltd.
LandOfFree
Method of making cantilever chip for scanning probe microscope does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making cantilever chip for scanning probe microscope, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making cantilever chip for scanning probe microscope will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1104047