Static information storage and retrieval – Interconnection arrangements
Patent
1998-11-23
2000-09-19
Nguyen, Tan T.
Static information storage and retrieval
Interconnection arrangements
365 52, 257686, 257673, 438613, G11C 506
Patent
active
061221872
ABSTRACT:
System modules are described which include a stack of interconnected semiconductor dies. The semiconductor dies are interconnected by micro bump bonding of coaxial lines that extend through the thickness of the various dies. The coaxial lines also are selectively connected to integrated circuits housed within the dies. In one embodiment, a number of memory dies are interconnected in this manner to provide a memory module.
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Ahn Kie Y.
Forbes Leonard
Micro)n Technology, Inc.
Nguyen Tan T.
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