Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent
1993-11-15
1995-10-03
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With heat sink embedded in encapsulant
257712, 257718, 361688, 361704, 361707, H01L 3902, H05K 200
Patent
active
054554624
ABSTRACT:
An integrated circuit package including a heat sink is disclosed. The package incorporates an sealing (or locking) ring located circumferentially around the heat sink to provide a better seal between the encapsulant and heat sink and to reduce the possibility that contaminants from outside the package will reach the interior semiconductor die. A stress relief section is formed in the package leads and a dielectric adhesive material is used to attach the package leads to a heat sink surface. The dielectric adhesive creates a secure bond between leads and heat sink, allows heat transfer from the leads to the heat sink, and prevents shorting of the leads to the heat sink.
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Amkor Electronics, Inc.
Crane Sara W.
Jr. Carl Whitehead
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