Phase change cooling of semiconductor power modules

Details Phase change cooling of semiconductor power modules Phase change cooling of semiconductor power modules

1993-08-09

1995-10-03

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257712, 257713, 257716, 257722, 361698, 361689, 361699, 361708, 361697, H01L 2302, H01L 2504, H01L 2348, H01L 3902

Patent

active

054554586

ABSTRACT:
Semiconductor wafer (22) and substrate (20) are enclosed in housing (12) on heat extracting base (14) . The space within the housing is filled with a phase change material (28) which absorbs heat at a transitional temperature below the critical temperature of the semiconductor wafer to absorb heat during peak loads. Wires (44) thermally couple the wafer (22) to the phase change material (28). Heat is extracted from both the semiconductor wafer and the phase change material through the base (14).

REFERENCES:
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4335781 (1982-06-01), Duffy
patent: 5185194 (1993-02-01), Miyake et al.
patent: 5243223 (1993-09-01), Yamada et al.

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